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Patent portfolio assigned to ZutaCore (verified via public assignee records). Israeli waterless two-phase direct-to-chip liquid cooling (HyperCool). Customers from own customer-stories page; Foxconn co-developed the SoftBank rack solution (partner). Patents confirmed: assignee ZUTA-CORE LTD. (WO2018167773A1 Cooling systems and methods, US10687441B2 Vacuum-based thermal management system).