TSMC's CoWoS advanced packaging capacity was the primary supply bottleneck for N

Details

as of

2024-07-15

statement

TSMC's CoWoS advanced packaging capacity was the primary supply bottleneck for NVIDIA's AI GPUs through 2024.

about → company2

• NVIDIA
• TSMC

about → packaging technology1

• CoWoS

about → supply shortage1

• CoWoS GPU shortage

evidence → supports1

• Demand for CoWoS far outstripped supply, with NVIDIA and AMD booking much of TSM

supports → result1

• Constrained packaging continued to limit how many AI accelerators NVIDIA could s